Intel is bouncing back from the bottom. All thanks to new lithographs

Intel is bouncing back from the bottom. All thanks to new lithographs

Intel He talks more and more boldly about the future of his production business. During the Morgan Stanley conference, the company’s CFO spoke and suggested that the foundry division may reach the break-even point faster than previously expected. New technological processes and growing interest from third parties play an important role here.

Key clients include Apple, NVIDIA and Qualcomm

David Zinsner emphasized that the development of production services has gained momentum under the leadership of the current CEO, Lip-Bu Tan. The company is trying to take advantage huge demand for artificial intelligence systems. One of the important steps was the successful launch of chip production Panther Lake. Lithography Intel 18A meets the design assumptions, and wafer yields systematically increase as the production lines mature.

What’s more, Intel expects the first binding agreements with customers interested in manufacturing with this technology. This also applies to the 18A-P variant. Previously, it was assumed that the company may have difficulties in attracting companies and only the next stage of development, i.e Intel 14Awill become the main offer for external partners. However, the latest statements suggest that the situation looks more optimistic.

Intel is bouncing back from the bottom. All thanks to new lithographs

Behind the scenes, information is increasingly emerging that Apple may become one of its key clients. The 18A-P process allows for very precise adjustment of the energy characteristics. The company would consider using this technology in the production of future M-series chips used in Mac computers.

During the speech, the topic of the next stage, the 14A process, also appeared. In recent months, there have been reports that its implementation may be delayed and production will not start until around 2028. Zinsner, however, assured that Intel is still sticking to its original release plan. Initial production is scheduled to start in 2027, with full production scheduled for 2029.

Intel is bouncing back from the bottom. All thanks to new lithographs

TSMC’s limited production capacity turns attention to Intel

The advanced chip packaging segment may also be a new source of revenue for Intel. According to the CFO, the company expects contracts worth billions of dollars, which may begin to materialize already in the second half of this year. EMIB and EMIB-T solutions attract the attention of many companies designing integrated circuits without their own factories.

Potential clients include companies such as Apple, NVIDIA and Qualcomm. There is also speculation in the industry that NVIDIA may use EMIB technology in systems Feynman. It is possible that we will learn more details during the conference GTC 2026.

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