The Wait Is Over: TSMC to Build a Plant in Europe

There are quite a few companies in the semiconductor production market, but the most important of them can be counted on the fingers of one hand – Korean SamsungAmerican Intel and Taiwanese TSMC. There is only one king, however, and we are talking about the Taiwanese. They have the latest lithographs and the greatest processing capacity.

The start of production is expected in 2027.

TSMC’s services are used by giants such as Apple, AMD, NVIDIA, Qualcomm, MediaTek and… Intel. No one should be surprised that new production plants are being built all the time. And it seems that the wait for FAB in Europe is finally overbecause construction is scheduled to start soon.

According to various foreign editorial offices, the construction of the factory in Dresden (Germany) will start in the coming weeks. It is assumed that the cornerstone will be laid at the end of August. That’s when CC WeiCEO at TSMC, is to visit our neighbors to sign documents with the German government.

Building a new FAB will cost 10 billion euros (approx. 42.9 billion zlotys) on the TSMC side, and additionally the city of Dresden will spend 250 million euros (approx. PLN 1.1 billion) on the modernization of the power grid and a special water supply system. Importantly the facility will not belong only to the Taiwanesebecause Infineon, Bosch and NXP are to have 10% shares each.

It is worth emphasizing that German plant TSMC will not offer the latest lithography. Production is expected to begin on second half of 2027and the main recipient is to be the European car market. So there is talk of lithography 28 or 22nm CMOS and 16 or 12nm FinFET. The planned processing capacity is approximately 40 thousand 12-inch silicon wafers per month.