Taiwan has reason to be happy. The next breakthrough in 2nm lithography
It seems that TSMC has no intention of resting on its laurels. It will not be easy for the competition to catch up with the Taiwanese giant in the semiconductor market.
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TSMC plans to start mass production of semiconductors in N2 lithography (2nm class) in the second half of next year. Currently, the company is working intensively on refining this technology, focusing on reducing the density of defects, which will translate into improved production yields.
We will get up to 30% lower power consumption
One of the employees of the Taiwanese giant, listed on the X platform (formerly Twitter) under a pseudonym “Dr. Kim”he boasted that he had succeeded improve yield by 6%. Although this does not sound impressive at first glance, considering the number of orders fulfilled by TSMC it means it billions in savings.
Customers like Apple, AMD, NVIDIA Whether Qualcomm They do not pay per system produced, but per silicon wafer. Therefore, the fewer defective CPUs, GPUs or SoCs there are in a batch, the lower the overall order cost. This may or may not mean lower prices for finished products.
TSMC N2 will be the company’s first lithograph using GAA (Gate-All-Around) technologywhich promises significantly lower power consumption, performance gains and higher transistor density. Chips produced using it are expected to be use 25% to 30% less energy than TSMC N3E.
According to currently available information, the Taiwanese will start a new production process in the second half of 2025and even closer to its end. Therefore, there is still a lot of time to detect errors in projects, make changes and corrections. This probably won’t be the last time we hear about increasing yield.
