Samsung changes plans. New memories only in 2026
Capacious and efficient semiconductor media will hit the market later than expected. At least those based on Samsung systems, because the Koreans have delays.
You can now find hundreds of them in electronics stores SSD from dozens of different brands from around the world. However, many of them are similar to each other. Why? There are only a handful of manufacturers of memory chips and controllers, and most companies only buy ready-made elements and assemble them.
SK hynix is hot on Samsung’s heels
Samsung is one of the giants that produces its own NAND. The Koreans were the first to introduce solutions with vertically arranged memory cells in 2013, and this year they debuted 286-layer memory cells. 9th generation V-NAND. However, crossing the 300-layer barrier turns out to be more difficult than expected.
The solution to this problem is supposed to be 10th generation V-NANDwhich abandons the technology currently used CoP (Co-Packaged) for BV (Bonding Vertical). To put it very simply, storage and peripheral circuits are to be fabricated on separate layers and then vertically connected. According to Samsung’s declaration, it has this increase bit density by 60%, which will translate into improved performance.
As reported by Korea Economic Daily citing its sources, Samsung’s current release plan assumes introducing at least 400-layer memories by 2026. This is to provide the company with a leading position on the market of suppliers of solutions for server rooms focusing on work with artificial intelligence.
Sounds good, right? Not really. Earlier plans envisaged 430-layer V-NAND already in 2025, so new reports suggest problems and delays. Direct competition, i.e. South Korean ones SK hynixis also working on 400-layer NAND chips. Here, estimates predict the start of mass production at the end of 2025, so introduction as early as 2026.
