AMD Zen 6 will offer up to 50% more cores and cache
AMD is preparing to present the first processors based on the architecture Zen 6 this year and everything indicates that it will be one of the biggest changes in recent years. New information has appeared on the Internet about the size of CCD systems that are to be produced for the first time in TSMC N2 lithography. They will be included in both the server series EPYC Veniceas well as consumer systems Ryzen 10000.
The new processors will still use the AMD AM5 socket
Please note that not all the processor will be made in a 2nm manufacturing process. For example, the I/O section is still supposed to use an older and more widely available node TSMC N3P. Cheaper, more budget models can also benefit from the same technology.
Returning to CCD, the well-known HXL informant prepared a comparison covering most AMD generations in recent years:
- Zen 2: 2×4 cores, 2×16 MB L3, TSMC N7, approx. 77 mm2
- Zen 3: 8 cores, 32 MB L3, TSMC N7, approx. 83 mm2
- Zen 4: 8 cores, 32 MB L3, TSMC N5, approx. 72 mm2
- Zen 5: 8 cores, 32 MB L3, TSMC N4, approx. 71 mm2
- Zen 6: 12 cores, 48 MB L3, TSMC N2, approx. 76 mm2
As you can see, Zen 6 will occupy ~76 mm2which is slightly more than in the case of Zen 4 and Zen 5, which powered the Ryzen 7000 and 9000 series. We are talking about an increase of 5-7% here, even though the number of cores increases from 8 to 12 and the L3 memory from 32 to 48 MB. This means as much as a 50% increase in both the number of cores and cache capacity with an almost unchanged silicon surface.
It looks even more interesting Zen 6ci.e. a slightly weaker part of the CPU with lower power consumption (equivalent to Intel’s E cores), where a single CCD is to be ~156 mm2but it will accommodate as many as 32 cores and 128 MB of L3 memory. In addition, you can expect improved IPC, higher clock speeds and further improvements in 3D V-Cache technology in gamer models.
